Lam Research 810-068158-015 Transport Module

Short Description:

FOB Price: US $0.5 - 9,999 / Piece

Min.Order Quantity: 100 Piece/Pieces

Supply Ability: 10000 Piece/Pieces per Month

Brand: Lam Research

Manager: Jinny

E-mail: sales5@xrjdcs.com

Tel: + 86-18250705533

( WhatsApp )Wechat: + 86-18250705533

Warranty: one year

In stock: In stock

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Product Detail

Product Tags

Lam Research 853-111462-019

1. Product Overview

The 810-068158-015 is a critical precision gas distribution and flow control component developed by Lam Research for its advanced plasma processing equipment. It is typically integrated into the gas box piping system of the reaction chamber or deployed as a standalone process gas delivery module. The core function of this module is to distribute and inject multiple process gases (including etchants, deposition precursors, carrier gases, and dilution gases) from the gas cabinet into the reaction chamber with ultra-high precision, ultra-fast response, and dedicated timing sequences. This forms a stable, uniform, and repeatable gas flow field and concentration distribution on the wafer surface, serving as the primary physical link for precise control of plasma chemical processes.

Unlike standard industrial pneumatic components, the 810-068158-015 is a custom high-performance core gas management solution tailored by Lam Research for specific etching and deposition platforms. Its fluid characteristic design, internal volume calibration, and material selection directly determine the execution accuracy of process recipes and final wafer yield.

2. Product Specifications

Parameter Name	Parameter Value
Product Model	810-068158-015
Manufacturer	Lam Research
Product Type	Precision Process Gas Distribution & Control Module
Applicable Gas Types	Corrosive gases (Cl₂, BCl₃, HBr), deposition gases (SiH₄, NH₃), inert gases (Ar, He, N₂), CxFy series etching gases
Flow Control Range	Typical 0 – 1000 sccm / 0 – 5000 sccm (depending on specific channel configuration)
Control Accuracy	Better than ±0.5% of full-scale setpoint
Response Time	< 500 ms (within 2% of setpoint)
Maximum Working Pressure	0.5 MPa (approximately 72.5 psi)
Internal Channel Volume	< 1.5 cc (minimizes gas residence and enables rapid gas switching)
Interface Type	Lam Research proprietary ultra-high-purity VCR or Swagelok metal face-seal fittings
Control Interface	Proprietary high-speed digital bus (compatible with modified DeviceNet or EtherCAT protocols)
Operating Temperature Range	15°C to 45°C (with active temperature control)
Material Composition	Body: Electropolished 316L stainless steel; Sealing: All-metal or Kalrez® perfluoroelastomer

3. Structure and Composition

The 810-068158-015 adopts a highly integrated, ultra-low-volume modular flow channel physical structure. Its main body is a precision-machined 316L stainless steel block with a complex network of intersecting internal flow channels fabricated via deep-hole drilling and special welding processes. This design eliminates extensive external piping and joints, fundamentally reducing leakage points and gas residence dead zones. The module surface integrates multiple ultra-high-purity gas inlet/outlet ports and mounting bases for MFCs, diaphragm valves, and pressure sensors. The entire module is enclosed in a temperature-controlled metal housing to stabilize internal gas temperature and prevent flow/pressure drift caused by temperature fluctuations.

Functionally, the module consists of three core integrated layers: execution layer, sensing layer, and communication & control layer. The execution layer comprises multiple ultra-clean, long-life electromagnetic or piezoelectric driven diaphragm valves featuring ultra-fast switching speed and excellent airtightness. The sensing layer includes high-precision thermal/capacitive mass flow sensors and capacitive diaphragm gauges for pipeline and chamber pressure monitoring. The communication & control layer is a customized embedded circuit board with dedicated flow control algorithm firmware, which processes upper-level commands, executes precise PID (Proportional-Integral-Derivative) calculations and valve timing logic, and provides real-time sensor data feedback. The tight collaboration of the three layers forms a complete closed-loop control from command parsing to physical flow output inside the module, reducing host controller load and significantly improving system response efficiency.

4. Key Features and Advantages

4.1 Ultra-High Control Accuracy and Dynamic Response

Equipped with high-performance integrated MFCs and high-speed valves, the module delivers fast, overshoot-free stable gas flow control across the full scale. Its ultra-short response time enables rapid gas switching and flow calibration, which is critical for advanced pulsed etching and deposition processes requiring millisecond-level gas sequence transitions. The minimal flow fluctuation after stabilization maintains consistent process gas partial pressure and plasma chemical states, supporting nanoscale Critical Dimension (CD) control and atomic-level thin-film deposition accuracy.

4.2 Extreme Corrosion Resistance and Particle Control

To adapt to highly corrosive and reactive semiconductor process gases, all fluid-contact surfaces of the 810-068158-015 undergo ultra-fine electrochemical polishing (Ra < 0.1μm), paired with all-metal or high-performance perfluoroelastomer sealing structures. This minimizes particle generation and adsorption. The dead-zone-free, low-residence internal flow channel design, combined with dedicated purge sequences, eliminates residual process gases to the ppt (parts per trillion) level, effectively preventing cross-contamination between process steps and ensuring ultra-low defect density on wafer surfaces.

4.3 Advanced Thermal Management and Long-Term Stability

The built-in active temperature control system stabilizes the module body temperature within an extremely narrow range (±0.5°C). Since gas density and MFC sensing performance are highly temperature-sensitive, precise thermal management suppresses measurement drift induced by ambient temperature variations and gas throttling effects. It ensures long-term repeatability of flow and pressure control, enabling consistent process results across different time periods, seasons, and equipment units, and greatly enhancing mass production reproducibility.

5. Application Fields

The 810-068158-015 is exclusively applied to core plasma processes in high-end semiconductor manufacturing, serving as a key gas delivery component for Lam Research’s mainstream Capacitive Coupled Plasma (CCP) etchers, Inductively Coupled Plasma (ICP) etchers, and Plasma-Enhanced Chemical Vapor Deposition (PECVD) systems. It is widely deployed in 300mm high-volume fabs for the full manufacturing cycle of logic chips (FinFET, GAA), memory chips (3D NAND, DRAM), and power devices.

In practical processes, the module governs the entire gas chemical reaction cycle from plasma ignition to process termination. For ultra-high aspect ratio channel hole etching in 3D NAND fabrication, it injects main etching gases (C₄F₆, C₄F₈), auxiliary gases (O₂, Ar), and deposition gases (C₄H₆) with precise timing and flow rates, realizing simultaneous etching, mask top protection, and sidewall passivation. For gate etching in logic chip manufacturing, it delivers complex mixed gas chemistries such as HBr/Cl₂/O₂ to achieve high-selectivity and low-damage etching of polysilicon and metal silicide layers. Its superior performance ensures faithful execution of sophisticated process recipes, acting as a decisive hardware foundation for converting process development results into stable mass production yields.

6. Related Products

810-068158-014: Predecessor model in the same series with minor differences in internal flow channel layout and sensor configuration, compatible with legacy equipment platforms and specific mature processes.
810-068158-016: Upgraded successor model equipped with extended-range MFCs and higher-speed communication protocols to support next-generation complex advanced processes.
853-111462-019: Core liquid chemical fluid management module by Lam Research, forming a complete process fluid delivery system when paired with the 810-068158-015 gas management module.
810-072687-414: RF power distribution and feeding component. Gas management and RF power delivery constitute the two core parallel subsystems of Lam Research process equipment.
810-003485-001: Dedicated inline gas filter installed at the inlet of 810-068158-015 for ultra-fine purification and nanoscale particle removal.
810-900007-001: On-site calibration toolkit for the module’s gas flow and pressure sensors, including standard leak test fixtures and calibration software authorization.

7. Installation and Maintenance

7.1 Pre-Installation Preparation

Installation of the 810-068158-015 requires high-precision and ultra-high-cleanliness operation, which must be performed under the guidance of Lam Research authorized engineers in full compliance with fab safety regulations. Before operation, fully close the main gas cabinet valve, purge and evacuate the pipeline to eliminate residual hazardous gases. Operators must wear complete cleanroom garments, anti-static gloves, and chemical-resistant protective equipment. The installation environment must meet Class 1 cleanroom standards.

Verify all interface specifications, installation orientation, and sealing surface integrity of the new module before installation. Fasten all connections to precise torque values using dedicated ultra-high-purity VCR wrenches. Strict helium leak testing is mandatory before startup to ensure all joint leakage rates meet or exceed factory specifications.

7.2 Maintenance Recommendations

A rigorous periodic preventive maintenance (PM) schedule is required for the 810-068158-015. Routine maintenance includes regular inspection of MFC zero drift and full-scale accuracy via equipment self-diagnosis software, daily verification of temperature control system functionality, and visual inspection of external gas fittings for discoloration or odor to detect micro-leaks.

Replace designated filter cartridges and conduct valve cycle life tests during each PM cycle. For flow deviation alarms, first troubleshoot upstream gas supply pressure and filter conditions before performing module recalibration. All disassembly and repair of internal flow plates, valves, and sensors are prohibited on-site; all such work must be completed by Lam Research certified engineers or processed via factory return for overhaul.