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Lam Research 810-800256-015 Node Type 3 PCB Assembly
Lam Research 810-800256-015
Product Overview
The Lam Research 810-800256-015 is a PCBA Node Type 3, Phase II PCB assembly exclusively deployed in Lam Research semiconductor manufacturing equipment. Multiple official equipment part references confirm this part number corresponds to a Node Type 3 board, which is defined as a Phase II and RoHS-compliant electronic assembly.
Serving as a core component of the device’s internal control architecture, this specialized electronic assembly is not a universal industrial PLC module. It is custom-designed for seamless integration and stable operation with compatible Lam Research wafer-processing equipment, undertaking dedicated equipment internal control tasks.
Technical Identification
The core technical parameter and attribute information of the 810-800256-015 assembly is sorted and summarized as follows:
Manufacturer: Lam Research Part Number: 810-800256-015 Product Type: PCBA / PCB Assembly Board Type: Node Type 3 Generation / Configuration: Phase II Compliance Standard: RoHS compliant (verified by official equipment suppliers) Core Function: Internal equipment control and node-level electronic signal processing Applicable Industry: Semiconductor manufacturing Applicable Equipment: Wafer fabrication equipment
It is worth noting that partial equipment databases associate this assembly with the model 50020R-10, and individual data sources mark it as a Node 1/2 board. Due to inconsistent secondary source descriptions, the accurate equipment compatibility of the board must be verified against on-site installed board information and official equipment technical documents before replacement and installation.
Board Architecture and Function
The 810-800256-015 is a professional dedicated printed circuit board assembly, not a universal standalone controller for ordinary automatic equipment. Its specific functional logic and operating mode are matched with the supporting Lam Research wafer-processing equipment it is installed in.
As a typical node-type board, it is an important part of the equipment’s distributed electronic architecture. In the overall equipment system, it cooperates with other on-board PCBs, sensors, actuators, power supply modules and control electronic components, independently undertaking specialized tasks including equipment control, data communication, operational monitoring and signal interface docking.
For semiconductor manufacturing high-precision equipment, the consistency of board revision is critical. Minor differences in hardware revision, built-in firmware versions, interface connector specifications and matching accessories may lead to system incompatibility, even if the boards have identical physical appearances.
Applications in Semiconductor Manufacturing
Matching Lam Research mainstream wafer fabrication equipment, the 810-800256-015 PCBA is widely involved in the after-sales maintenance and spare parts supporting system of semiconductor process equipment. All official equipment part databases uniformly classify it as a Node Type 3 Phase II professional assembly.
Its main application scenarios in semiconductor manufacturing maintenance and operation are as follows:
- Daily operation and maintenance of wafer processing production equipment
- Technical support for semiconductor fabrication integrated systems
- Detection and replacement of equipment core control electronic components
- Operation guarantee of distributed mechanical control assemblies
- Refurbishment and upgrading of aging process equipment
- Regular preventive maintenance of production equipment
- Emergency replacement of faulty node control boards
- Full lifecycle technical support of semiconductor manufacturing equipment
Installation and Maintenance Specifications
The 810-800256-015 board can only be installed in officially verified compatible equipment configurations. Before replacement and installation, professional technicians must strictly check and confirm the complete part number, board revision, connector specifications, component layout and all identity marking information of the new and old boards to avoid matching errors.
Electrostatic discharge (ESD) protection measures must be implemented during all handling operations. The board shall be stored and transported in qualified antistatic packaging, and technicians shall avoid direct contact with exposed precision electronic components to prevent static damage and component failure.
In equipment fault troubleshooting, it is necessary to first inspect matching cables, connectors, power supply modules and adjacent circuit boards. Most node board operation faults are caused by external power supply abnormalities, communication signal failures or peripheral equipment anomalies, rather than damage to the PCBA itself.
Replacement and Procurement Considerations
As a professional dedicated spare part for semiconductor high-end equipment, the supply availability of the 810-800256-015 is affected by part condition and equipment service lifecycle. The secondary market currently provides used and disassembled parts of this Node Type 3 Phase II board for equipment maintenance and replacement.
When consulting quotations or purchasing replacement parts, it is necessary to provide the complete part number 810-800256-015, on-site photos of the original board, as well as all serial numbers, revision codes and assembly accessory information. This specification is particularly important for early-generation Lam Research equipment with multiple iterative board revisions, which can effectively avoid procurement errors.
For semiconductor production factories and professional equipment service providers, accurately screening and purchasing matching replacement boards can significantly shorten fault troubleshooting time, improve equipment repair efficiency, and quickly restore normal production operation.
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