Lam Research 810-802902-019

Product Overview

The Lam Research 810-802902-019 is a PCB assembly identified as a Node 2 PM motherboard, with available product references also describing it as a Node 2 PM HE board. It is associated with Lam Research semiconductor manufacturing equipment and is designed as part of the equipment’s control and interconnection architecture.

The board is commonly listed under the description “PCB Assy MB Node 2 PM HE”, indicating its role as a motherboard-level assembly within a Node 2 process module. This makes it a specialized replacement component for semiconductor production equipment rather than a general-purpose industrial motherboard.

Technical Specifications

The part number and functional description are consistently identified across semiconductor-equipment spare-parts listings. The exact electrical ratings, connector configuration, processor devices, and supported equipment revision should be verified against the equipment documentation and the revision marking on the physical board before replacement.

Key Features

• Designed for integration into Lam Research semiconductor processing equipment.
• Node 2 motherboard architecture for PM-related equipment control.
• PCB assembly format suitable for equipment-level replacement and servicing.
• Supports internal control, communication, and interconnection functions within the associated equipment architecture.
• Specialized design intended for semiconductor manufacturing environments.
• Available listings identify REV B for this part number, so revision matching is important when sourcing a replacement.

Board Construction and Components

The 810-802902-019 is a complete PCB assembly rather than a simple discrete electronic component. Its motherboard-level construction provides the physical platform for electronic circuits, connectors, interface circuitry, and other components required by the Node 2 PM architecture.

Because semiconductor equipment is highly configuration-dependent, the board should be evaluated as a complete assembly. Connector locations, board revision, component population, firmware dependencies, and equipment configuration can all influence interchangeability. The REV B identification reported for this model should therefore be checked against the installed board before procurement.

Applications and Replacement

The primary application of the Lam Research 810-802902-019 is semiconductor manufacturing equipment, particularly equipment incorporating the corresponding Node 2 PM HE architecture. It can be considered for maintenance programs, equipment refurbishment, system restoration, and replacement of a failed or degraded motherboard assembly.

When purchasing a replacement, users should confirm the complete part number, revision, physical condition, connector arrangement, and equipment compatibility. For used or refurbished boards, inspection and functional verification are recommended before installation.

Installation and Maintenance

Installation should be performed by qualified semiconductor-equipment technicians familiar with the relevant Lam Research platform. Before removing the original board, disconnect equipment power according to the applicable service procedure and follow appropriate electrostatic-discharge protection practices.

During maintenance, inspect the PCB for damaged connectors, corrosion, contamination, cracked solder joints, burnt components, or other visible abnormalities. Keep the board protected from dust, moisture, and electrostatic discharge during storage and handling.

For a successful replacement, compare the incoming 810-802902-019 with the existing board and verify the revision and equipment configuration before commissioning. Proper documentation of the original board’s connections can also help reduce installation errors.

Note: Publicly available information confirms the model as a Node 2 PM motherboard/PCB assembly, but detailed electrical specifications and exact equipment compatibility are not consistently published. These details should therefore be confirmed from the applicable equipment documentation or the physical board label before installation.