Main Technical Specifications

Product Features

• High-Performance Computing: Equipped with a PowerPC processor, along with L2/L3 cache and AltiVec coprocessor, it is suitable for high-speed digital signal processing and real-time control.
• Balanced I/O and Bus: Features dual PCI, dual PMC, Gigabit Ethernet, and multiple serial ports, providing abundant expansion capabilities.
• Reliability and Anti-Interference: Adopts industrial-grade components, ECC memory, and a wide temperature operating range, enabling long-term operation in harsh environments.
• Backward Compatibility: Compatible with VMEbus infrastructure, offering a smooth migration path from legacy MVME series (2300-5100).
• Modular Design: Supports various mezzanine cards (for storage, communication, and dedicated I/O), facilitating customization based on application requirements.

Structure and Composition

• CPU Module: MPC7455/7457 processor and its cache subsystem.
• Memory Subsystem: On-board ECC DDR SDRAM, providing a capacity of 512 MB-1 GB (2 GB optional).
• Storage Subsystem: On-board Flash (40 MB) + optional 2.5-inch hard drive/SSD.
• Bus/Expansion: Dual 64-bit PCI slots, dual PMC slots, 64-bit PCI Mezzanine expansion connectors.
• Network/Communication: Gigabit Ethernet, 10/100 Base-TX Ethernet, RS-232 serial ports.
• Power Management: 24 V DC main power supply, internally generating +5 V, +3.3 V, +12 V auxiliary voltages.

Typical Application Fields

• National Defense and Aerospace: Serves as an embedded computing platform with high reliability and a wide temperature range.
• Industrial Automation: Applied in real-time control systems such as PLCs, motion control, and process monitoring.
• Medical Imaging: Used in CT and MRI acquisition systems that require high-bandwidth data processing.
• Communication Base Stations: Acts as a front-end processing unit to provide high-speed data forwarding.
• Scientific Research Experiments: Functions as a high-performance platform for digital signal processing and data acquisition.

Installation and Maintenance Guidelines

Installation

1. Insert the board into a 6U chassis or backplane that complies with VMEbus specifications, ensuring good contact between the heat sinks corresponding to the PCI/PMC slots and the chassis.
2. Use 24 V DC for power supply. Check the power polarity and voltage regulation range to avoid transient shocks.
3. After connecting the network, serial ports, and storage media, perform a Power-On Self-Test (POST) to verify the hardware status.

Heat Dissipation and Environment

• In high-temperature or high-altitude environments, it is recommended to install fans or implement forced air cooling to keep the chip temperature within the rated range.
• For dust-proof and moisture-proof requirements, use protective covers or sealed chassis.

Software and Firmware

• Utilize the Board Support Package (BSP) provided by Emerson, or real-time operating system images such as VxWorks and Linux.
• Regularly check and update the BIOS/firmware to obtain the latest compatibility and security patches.

Troubleshooting

• The on-board debug monitor provides self-test logs, which can be accessed via serial ports or Ethernet.
• ECC memory errors are recorded in the system logs; replace the affected memory modules if necessary.

Maintenance Cycle

• It is recommended to conduct a comprehensive inspection every 12 months, including tightening and cleaning the power supply, heat sinks, and connectors.
• For systems operating in extreme environments (-40 °C ~ +85 °C), functional verification should be performed every 6 months.