GE DS200LDCCH1APA

The GE DS200LDCCH1APA is a Drive Control and Local Area Network (LAN) Communication Board (LDCC) in the General Electric (GE) Mark V series. It is specifically designed for DIRECTO-MATIC 2000 series drives and exciters, and plays a core role in drive control, I/O control, and network communication in gas turbines, steam turbines, and combined cycle power generation systems.

Key Technical Specifications

• Model/Part Number: DS200LDCCH1APA (also marked as DS200LDCCH1A)
• Series: Mark V (Speedtronic)
• PCB Layers: 7-layer PCB with conformal coating
• Processor: Four microprocessors, equipped with multiple flash memory modules and EEPROM for redundant backup
• Interfaces: 10 interfaces, supporting multiple bus systems such as RS-485, Ethernet (DLAN), C-bus, CPL, and Genius bus
• Power Supply: 24 V DC; Operating temperature range: -40 °C to 85 °C; Humidity: 5%–95%
• Dimensions/Weight: Approximately 220 mm × 165 mm × 25 mm; Weight: about 500 g (around 2 pounds)
• Functions: Drive control, speed/torque regulation, sensor input monitoring, operator command response, LAN communication, application software storage, diagnostic testing, and system reset

Product Features

• High Reliability: Adopts triple redundant backup and self-diagnostic functions, enabling automatic switching in case of faults to ensure continuous operation of critical turbine systems.
• Multi-Protocol Compatibility: Supports multiple industrial buses and Ethernet protocols, facilitating integration with DCS/PLC systems of different brands.
• Modular Design: Integrates drive, I/O, and communication functions on the board, simplifying system wiring and reducing maintenance costs.
• Easy Maintenance: Provides LED status indicators, remote diagnostic interfaces, and field-adjustable parameters to support rapid fault location and recovery.
• Wide Adaptability: Compatible with GE’s DIRECTO-MATIC 2000 series drives and exciters, suitable for gas turbines, steam turbines, wind power, oil energy, and other industrial scenarios.

Structure and Composition

• Core Circuit Board: 7-layer multi-layer PCB with a conformal coating on the surface to enhance environmental resistance.
• Microprocessor Array: Four microprocessors responsible for real-time control and communication tasks.
• Storage Unit: Includes multiple flash memory modules for program storage and EEPROM for parameter persistence.
• Interface Module: Provides RS-485, Ethernet, and multiple bus connection ports.
• Power Supply and Heat Dissipation: 24 V DC power input, equipped with heat sinks to ensure stable operation in high-temperature environments.

Typical Application Fields

• Power Plants: Drive and excitation control for gas turbines, steam turbines, and combined cycle systems.
• Oil and Gas Industry: Compressor drive, pump station control, and on-site monitoring.
• Wind Power Generation: Wind turbine drive control and remote diagnostics.
• Heavy Industries: Used for precise control and status monitoring of large motors and drive systems in chemical, paper, food and beverage industries.

Installation and Maintenance Points

Installation Preparation

1. Verify the model and system compatibility, and ensure sufficient heat dissipation space inside the chassis.
2. Check that the power supply voltage and grounding meet the specifications.

Mechanical Fixing

• Use original screws to fix the PCB on the rack to prevent solder joint loosening caused by vibration.

Wiring

• Correctly connect RS-485, Ethernet, and I/O ports according to the wiring diagram, and maintain good cable shielding to prevent electromagnetic interference.

Software Configuration

• Load the corresponding firmware and parameter files using the configuration tool provided by GE, and save them to EEPROM after on-site debugging.

Functional Self-Test

• After power-on, the on-board self-test program will light up the indicator lights to confirm that all microprocessors, communication interfaces, and power modules are working normally.

Regular Maintenance

1. Check the tightness of connectors, clean dust, and measure the board temperature every 6 months.
2. Use remote diagnostic functions to read fault logs and replace potentially aging components in advance.

Spare Parts Management

• Since this model has been discontinued, it is recommended to establish a spare parts inventory at the initial stage of the project to ensure quick replacement when needed.

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