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Lam Research 853-800085-012 Industrial Module
Lam Research 853-800085-012
Product Overview
The Lam Research 853-800085-012 is a high-purity Quartz Ring specially designed for Lam Research semiconductor manufacturing equipment. It is primarily deployed in core process chambers for Etch and Chemical Vapor Deposition (CVD) processes. As a critical component for wafer processing environment management, it is installed inside the reaction chamber to perform key functions including plasma focusing, reaction zone confinement, chamber wall protection against corrosive gas erosion, and uniform process gas distribution.
This quartz ring directly determines the etch rate uniformity and particulate contamination control level on wafer surfaces, serving as a core guarantee for yield stability and performance consistency in chip manufacturing.
Fabricated from high-purity, low-impurity Fused Silica material, the component undergoes precision mechanical machining and rigorous surface treatment processes to ensure its dimensional tolerance and surface finish fully comply with Lam Research original equipment manufacturer (OEM) design specifications. Exhibiting exceptional high-temperature resistance, corrosion resistance, and thermal shock resistance in harsh plasma environments, the Lam Research 853-800085-012 effectively extends chamber maintenance cycles. As an integral part of the process kit, it works in synergy with focus rings, edge rings and other components to build a stable and repeatable process environment, making it an indispensable consumable for semiconductor front-end manufacturing processes.
Product Specifications
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Parameter Name
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Parameter Value
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Product Model
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853-800085-012
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Manufacturer
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Lam Research
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Product Type
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High-Purity Quartz Ring (Process Chamber Component)
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Material
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High-Purity Fused Silica
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Purity
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≥ 99.99% (SiO₂)
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Density
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2.2 g/cm³ (Typical Value)
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Maximum Operating Temperature
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≥ 1000°C (Softening Point)
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Coefficient of Thermal Expansion
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~ 5.5 x 10⁻⁷ /°C (Ultra-Low Thermal Expansion)
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Surface Finish
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Compliant with Lam Research Chamber Cleanliness Standards
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Dimensions
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Compliant with OEM specifications for Lam Research 8-inch (200mm) and 12-inch (300mm) etchers
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Applicable Processes
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Plasma Etching, CVD, PVD
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Applicable Equipment
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Lam Research 2300 Series, Kiyo Series and other compatible platforms
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Structure and Composition
The Lam Research 853-800085-012 features a compact and precision-engineered annular structure with a custom cross-sectional profile. Its cross-sectional geometry, including steps, chamfers and positioning grooves, varies according to its installation position in the chamber (upper electrode ring, lower electrode ring or liner ring), enabling precise assembly positioning and directional gas flow guidance.
This quartz ring is a monolithic component constructed from single high-density quartz crystal, rather than a multi-layer composite structure. This design fundamentally eliminates contamination risks and stress cracking issues caused by material interface mismatch.
The core advantages of the component lie in its ultra-high machining accuracy and superior surface quality. Its inner and outer diameter dimensions, flatness and parallelism all meet micron-level tolerance requirements, ensuring precise fitting with adjacent components such as Electrostatic Chucks (ESC), edge rings and upper electrode assemblies. This tight fit prevents process gas leakage and abnormal electrical discharge during operation.
Additionally, the product undergoes multiple post-processing procedures including precision grinding, polishing and ultra-clean cleaning to eliminate microscopic surface damage and remove residual metal ions and organic contaminants. With a pure physical structure, its performance fully relies on the intrinsic material properties and high-precision processing quality. Under continuous plasma bombardment, it forms a stable and inert boundary layer that effectively confines plasma, protects metallic chamber components from corrosion, maintains chamber integrity, and minimizes particulate defects.
Key Features and Advantages
Ultra-High Purity Material with Low Contamination Risk
Manufactured with ultra-high-purity fused silica, the Lam Research 853-800085-012 maintains extremely low levels of transitional metal impurities (Fe, Cu, Ni, etc.). This attribute is critical for semiconductor front-end processes, as it effectively prevents metal ions from being activated and migrating onto wafer surfaces under high-temperature and plasma environments. It significantly reduces device leakage current and avoids yield loss caused by metallic contamination.
Superior Plasma Corrosion Resistance
The quartz ring delivers an ultra-low etching rate in highly corrosive plasma atmospheres containing fluorine-based gases (CF₄, CHF₃, SF₆) and chlorine-based gases (Cl₂, BCl₃). Its excellent corrosion resistance ensures long-term dimensional stability during continuous process operation, mitigates critical dimension (CD) drift, extends preventive maintenance (PM) intervals, and improves equipment uptime.
Excellent Thermodynamic Stability
Benefiting from the ultra-low thermal expansion coefficient of fused silica, the component boasts outstanding thermal shock resistance. During repeated process cycles involving high-temperature plasma bombardment and low-temperature cooling, it resists stress cracking, warping and deformation. It maintains stable mechanical fitting under drastic temperature fluctuations, consistently regulates uniform plasma distribution, and guarantees high consistency of etching and thin-film deposition processes.
Application Fields
The Lam Research 853-800085-012 is a core consumable for semiconductor front-end manufacturing processes, widely applied in the production of logic chips, DRAM and NAND Flash memories. Its primary application covers plasma etching processes for 8-inch (200mm) and 12-inch (300mm) wafers, including but not limited to Shallow Trench Isolation (STI) Etch, Gate Etch, Contact Etch and Metal Interconnect Etch. Serving as a chamber liner and plasma focus ring, it accurately confines plasma above wafer surfaces to achieve high-selectivity and anisotropic etching results.
Furthermore, it is extensively used in advanced thin-film deposition processes such as Plasma-Enhanced Chemical Vapor Deposition (PECVD) and High-Density Plasma Chemical Vapor Deposition (HDP-CVD). It optimizes thin-film uniformity and suppresses unintended deposition on chamber wall surfaces. For Fab process integration engineers and equipment engineers, this quartz ring is a key inventory material for daily operation management and periodic replacement. Its quality and service cycle directly impact production line yield, equipment utilization rate and overall operational costs. Adopting high-quality OEM-spec quartz rings is a prerequisite for stable process matching and qualified electrical performance of finished chips.
Related Products
Lam Research 853-800085-011: The previous generation model with minor differences in dimensional tolerance and chamfer design. Compatible with early-stage processes and legacy equipment, serving as an alternative and reference option.
Lam Research 853-800085-013: An upgraded version optimized in material purity and surface treatment technology, designed to meet stricter defect control requirements for advanced processes (7nm/5nm and below).
Lam Research 853-800085-010: A mainstream model in the same series, commonly used as matching upper or lower electrode rings depending on equipment configuration. It forms a complete plasma confinement system when paired with the 853-800085-012 model.
Lam Research 853-800084-xxx: A series of quartz rings adapted for different process chambers and equipment platforms with differentiated specifications, requiring strict model matching during selection.
Lam Research 953-800085-012: A variant model marked by the prefix “9″, customized for different wafer size platforms (e.g., conversion between 300mm and 200mm or experimental platforms). It adopts high-purity quartz material with distinct overall dimensions and mounting interfaces.
Installation and Maintenance
Pre-Installation Preparation
Before installing the Lam Research 853-800085-012, ensure the equipment is fully shut down, powered off, vented to atmospheric pressure, and the process chamber is cooled to room temperature. All installation operations must be performed in a Class 100 clean environment by operators wearing standard cleanroom frocks, gloves and masks.
Thoroughly clean the mounting base and chamber inner wall with professional lint-free tools and Isopropyl Alcohol (IPA), then purge with high-purity nitrogen. Handle the quartz ring with extreme care to avoid collision and scratching. Fasten pressure rings and screws strictly in accordance with the torque sequence and parameter values specified in the official Lam Research equipment maintenance manual.
Maintenance Guidelines
As a process consumable, the service life of the quartz ring is determined by equipment RF process hours. Equipment engineers shall conduct regular inspections via optical microscopes and particle detectors per standardized PM plans, focusing on surface cracks, notches, discoloration and particulate adhesion. Thickness inspection is required after each chamber dry clean to evaluate residual service life.
Immediate replacement is mandatory once excessive wear or structural damage is detected, so as to prevent wafer scrap and equipment malfunctions caused by component failure.
Product Warranty & Support
We guarantee all supplied Lam Research 853-800085-012 quartz rings are high-quality products fully compliant with OEM specifications. A six-month warranty is provided from the date of delivery, covering quality defects caused by raw material flaws and manufacturing process errors.
We maintain a comprehensive supply chain and after-sales service system, providing responsive technical consultation and on-site support for customers. Fully aware of the stringent purity and reliability requirements of semiconductor manufacturing, we implement strict incoming quality inspection and ultra-clean treatment for all products before delivery to ensure full compliance with high-standard process requirements. Choosing our products means establishing a reliable long-term cooperative partnership.
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