1. Product Overview

2. Core Specifications of Single B200 GPU

2.1 Architecture & Manufacturing Process

• Architecture: First-generation Blackwell (dual-die design)
• Process Technology: TSMC 4NP (≈4nm)
• Transistor Count: 20.8 billion
• Packaging: Dual-die packaging with NV-HBI inter-die interconnect (10 TB/s bandwidth)

2.2 Compute Cores

• SM Count: 148 Streaming Multiprocessors
• CUDA Cores: 20,480
• Tensor Cores: 640 fifth-generation Tensor Cores, supporting FP4, FP6, FP8 and FP16 precision computing
• Transformer Engine: Second-generation, optimized for LLM attention mechanism computing

2.3 Memory System

• Memory Capacity: 192GB HBM3e (8-stack configuration)
• Memory Bus Width: 8192-bit
• Memory Bandwidth: 8 TB/s
• ECC Support: Enabled

2.4 Dense Computing Performance (Single Card)

• FP4 (Inference): 12 PFLOPS (16 PFLOPS for sparse computing)
• FP8 (Training): 9 PFLOPS
• FP16/BF16: 4.5 PFLOPS

2.5 Interconnect & Interface

• NVLink 5: 1.8 TB/s bidirectional bandwidth
• PCIe Generation: Gen6, 256 GB/s bandwidth
• Physical Interface: SXM5 (liquid cooling)

2.6 Power Consumption & Thermal Solution

• Typical Power Draw: 1000W
• Cooling Solution: Cold-plate liquid cooling (standard configuration for DGX B200 system)

3. DGX B200 (8-GPU Complete System) Specifications

3.1 Hardware Configuration

• GPU Module: 8 × B200 SXM5 GPUs, total HBM3e memory up to 1.5TB
• CPU: 2 × Intel Xeon Platinum 6776P (64 cores / 128 threads per processor)
• System Memory: 2TB (expandable to maximum 4TB)
• NVSwitch: 2 × fifth-generation NVSwitch, aggregated bandwidth up to 14.4 TB/s
• Network Configuration: 8 × OSFP 400G InfiniBand ports; 2 × BlueField-3 400G DPU
• Storage: 8 × E1.S 3.84TB NVMe SSD (total storage: 30.72TB)
• Total System Power Consumption: Approximately 10.5kW
• Chassis Specification: 10U rack-mounted, liquid cooling design

3.2 System Computing Performance

• FP4 Inference Performance: 96 PFLOPS
• FP8 Training Performance: 72 PFLOPS
• FP16 Computing Performance: 36 PFLOPS