NVIDIA H100
1. Product Overview
The NVIDIA H100 (Codename: GH100) is the first-generation flagship GPU based on the Hopper architecture, unveiled by NVIDIA at GTC 2022 and mass-produced in 2023. It serves as the core cornerstone for the booming development of large AI models.
- Positioning: Primary GPU for training 7B–175B LLMs, inference for early trillion-parameter models, and the predecessor of H200/B200/B300 series GPUs
- Architecture: Hopper (Single Die)
- Process Technology: TSMC 4nm
- VRAM: 80GB HBM3
- Form Factor: Dual versions including SXM5 liquid-cooled and PCIe air-cooled
- 2026 Market Status: Discontinued or reduced production; the market is dominated by second-hand and leased devices with extremely high cost-performance for inference workloads
2. Core Specifications of Single H100 GPU
2.1 Architecture & Process Technology
- Architecture: Hopper (GH100, Single Die)
- Process Technology: TSMC 4nm
- Transistor Count: Approximately 80 billion
2.2 Compute Cores
- Streaming Multiprocessors (SMs): 132
- CUDA Cores: 16,896
- Tensor Cores: 528 (4th Generation)
- Supported Precision Formats: FP8, FP16, BF16, TF32, FP64 (FP4 is not supported)
2.3 Memory System
- VRAM Capacity: 80GB HBM3
- Memory Bus Width: 8192-bit
- Memory Bandwidth: 3.35 TB/s
- ECC Support: Full-capacity ECC enabled
- MIG (Multi-Instance GPU): Supports up to 7 independent GPU instances (10GB per instance)
2.4 Single-GPU Dense Computing Performance
- FP8 (Training): 3.94 PFLOPS
- FP16/BF16: 1.97 PFLOPS
- FP64 (Scientific Computing): 61.8 TFLOPS
- INT8: 3.94 TOPS
2.5 Interconnection & Interfaces
- NVLink 4: 450GB/s unidirectional bandwidth, 900GB/s bidirectional bandwidth
- PCIe Gen5: 128GB/s bandwidth
- Interface Types: SXM5 (liquid-cooled) / PCIe (air-cooled)
2.6 Power Consumption & Cooling
- TGP: 700W (SXM version) / 600W (PCIe version)
- Cooling Solution: Liquid cooling for SXM version; air cooling / cold plate cooling for PCIe version
3. DGX H100 (8-GPU Server) Specifications
3.1 Hardware Configuration
- GPU Module: 8 × H100 SXM5 GPUs, with a total HBM3 memory of 640GB
- CPU: Dual Intel Xeon Platinum 8480C processors (56 cores × 2)
- System Memory: 2TB DDR5 (maximum expandable to 4TB)
- NVSwitch: 4 × 4th-generation NVSwitch, with aggregated bandwidth of 7.2TB/s
- Network Module: 10 × ConnectX-7 400G InfiniBand / Ethernet ports
- Storage Configuration: 8 × E1.S 3.84TB NVMe SSDs (total storage of 30.72TB)
- Total System Power Consumption: Approximately 8kW
- Chassis Specification: 10U rack-mounted chassis, liquid-cooled design
3.2 Overall System Computing Performance
- FP8 Training Performance: 31.5 PFLOPS
- FP16 Computing Performance: 15.7 PFLOPS
- FP64 Computing Performance: 494 TFLOPS
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