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NVIDIA H200 After-Sales Service with No Worries Featured Image
  • NVIDIA H200 After-Sales Service with No Worries

NVIDIA H200 After-Sales Service with No Worries

Short Description:

The NVIDIA H200 (codename: GH200) is the final flagship GPU based on the Hopper architecture, unveiled by NVIDIA at SC23 in 2023 and launched for mass production in Q2 2024. It is the world’s first GPU equipped with HBM3e memory.


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  • Brand: NVIDIA
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    NVIDIA H200

    1. Product Overview

    The NVIDIA H200 (codename: GH200) is the final flagship GPU based on the Hopper architecture, unveiled by NVIDIA at SC23 in 2023 and launched for mass production in Q2 2024. It is the world’s first GPU equipped with HBM3e memory.
    Positioning: Primary accelerator for 7B–70B LLM training, high-concurrency inference for 13B–70B large language models, the preferred upgrade solution for H100 clusters, and the most cost-effective mainstream flagship GPU in the current market.
    Architecture: Hopper (enhanced version of GH100, single-die design)
    Process Technology: TSMC 4nm process
    Memory: 141GB HBM3e (double the memory capacity of H100)
    Form Factor: Dual versions including SXM5 liquid-cooled model and PCIe air-cooled model
    Product Position: Predecessor of B200/B300 series, and a direct upgrade and replacement for the H100 GPU

    2. Detailed Specifications of Single H200 GPU

    2.1 Architecture & Process Technology

    Architecture: Hopper (GH200, single-die)
    Process Technology: TSMC 4nm
    Transistor Count: Approximately 80 billion

    2.2 Computing Cores

    Streaming Multiprocessors (SMs): 132
    CUDA Cores: 16,896
    4th-Generation Tensor Cores: 528
    Supported Precision Formats: FP8, FP16, BF16, TF32 (FP4 is not supported)

    2.3 Memory System

    Memory Capacity: 141GB HBM3e
    Memory Bus Width: 8192-bit
    Memory Bandwidth: 4.8 TB/s
    ECC Support: Full-capacity ECC enabled
    MIG Partitioning: Maximum 7 independent instances (18GB memory per instance)

    2.4 Single-Card Dense Computing Performance

    FP8 (Training): 3.94 PFLOPS
    FP16/BF16: 1.97 PFLOPS
    INT8: 3.94 TOPS

    2.5 Interconnection & Interfaces

    NVLink 4.0: 450GB/s unidirectional bandwidth, 900GB/s bidirectional bandwidth
    PCIe Gen5: 128GB/s bandwidth
    Interface Types: SXM5 (liquid-cooled) / PCIe (air-cooled)

    2.6 Power Consumption & Thermal Dissipation

    Total Graphics Power (TGP): 700W (SXM version) / 600W (PCIe version)
    Cooling Solution: Liquid cooling for SXM model; air cooling / cold plate cooling for PCIe model

    3. DGX H200 (8-GPU Server) Full Specifications

    3.1 Hardware Configuration

    GPU Configuration: 8 × H200 SXM5 GPUs, with a total HBM3e memory of 1,128GB
    CPU Configuration: Dual Intel Xeon Platinum 8480C processors (56 cores per CPU)
    System Memory: 2TB DDR5 (expandable up to 4TB)
    NVSwitch: 4 × 4th-generation NVSwitch, with aggregated bandwidth of 7.2TB/s
    Network Configuration: 10 × ConnectX-7 400G InfiniBand / Ethernet ports
    Storage Configuration: 8 × E1.S 3.84TB NVMe SSDs (total storage of 30.72TB)
    Total System Power Consumption: Approximately 8kW
    Chassis Specification: 10U rack-mounted, liquid-cooled chassis

    3.2 Overall System Computing Performance

    FP8 Training Performance: 31.5 PFLOPS
    FP16 Computing Performance: 15.7 PFLOPS
    INT8 Computing Performance: 31.5 TOPS

    ____________________________________________________________

    NVIDIA  B300
    NVIDIA  B200
    NVIDIA  H200
    NVIDIA  H100

     

    NVIDIA H200

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