Schneider TSXP5710M

The TSXP5710M is a Premium Processor from Schneider Electric’s Modicon TSX series, belonging to the TSX Premium module family. Equipped with a 32-bit ARM Cortex-A8 processor, it is engineered for high-performance and reliable industrial automation control. Supporting multiple fieldbuses and Ethernet communication, this processor delivers high-speed, precise logic operations and data acquisition even in harsh factory environments.

Key Technical Specifications

• Processor Architecture: 32-bit ARM Cortex-A8, maximum clock speed of 600 MHz
• Memory: 256 MB built-in DDR3 RAM, expandable via external SD card or eMMC storage
• Input/Output: 8 digital inputs, 8 digital outputs (relay or transistor type optional), and 4 analog inputs/outputs (0-10 V / 4-20 mA)
• Communication Interfaces: Ethernet (10/100 Mbps) + Modbus TCP, EtherNet/IP, PROFINET, CANopen, Profibus DP (via optional communication modules)
• Power Supply: 100-240 VAC, power consumption approx. 26 W (with TSX PSY2600 power supply)
• Operating Temperature: -20 °C to +60 °C, compliant with IEC 60730-1 safety standard
• Dimensions: 3U × 84 mm × 120 mm (standard rack size), directly mountable to TSX racks or bases

Product Features

• High-Performance Computing: Powered by ARM Cortex-A8, supporting multi-tasking Real-Time Operating System (RTOS) and IEC 61131-3 programming languages.
• Modular Design: Adopts TSX Premium modular structure with hot-swappable sub-modules for CPU, I/O, and communication, enabling quick on-site replacement and expansion.
• Rich Communication Capabilities: Built-in Ethernet combined with optional communication cards enables multi-protocol interconnection, meeting cross-plant and cross-system data exchange needs.
• Robust Safety & Redundancy: Supports dual-system hot standby, Watchdog, built-in safety functions (safety I/O, emergency stop), and IEC 61508 SIL 2 safety certification.
• Easy Integration: Compatible with Schneider EcoStruxure Control Expert (formerly Unity Pro) development environment, providing comprehensive libraries, diagnostic tools, and remote monitoring interfaces.

Structure & Composition

• CPU Motherboard: Core processing unit integrating processor, memory, system bus, and power management.
• I/O Sub-modules: Digital, analog, relay/transistor output modules, freely combinable based on on-site requirements.
• Communication Sub-modules: Optional plug-in cards for Ethernet, PROFINET, Modbus TCP, CANopen, etc.
• Rack/Base: Standard 3U rack or wall-mounted base with heat sinks and fans for thermal stability during long-term operation.
• Power Supply Module: TSX PSY2600 (100/240 VAC → 24 VDC, 26 W) provides regulated power output.

Typical Application Areas

• Discrete Manufacturing: High-speed motion control and process monitoring for packaging, printing, food and beverage production lines.
• Process Industry: Continuous monitoring and safety protection scenarios in chemical, petroleum, metallurgical industries, etc.
• Building Automation: Energy management, HVAC, and lighting control systems for large commercial buildings.
• Energy & Power: Distribution automation, substation monitoring, and microgrid management.
• Transportation Infrastructure: Real-time control for subway, light rail, and airport baggage handling systems.

Installation & Maintenance Guidelines

On-site Preparation

• Ensure the cabinet or wall-mounted base complies with 3U standards and reserve sufficient heat dissipation space.
• Power wiring must adhere to local electrical codes (100-240 VAC) with reliable grounding.

Module Assembly

• Install the CPU motherboard first, then insert required I/O and communication sub-modules sequentially, securing with dedicated clips for firm connection.

Wiring Inspection

• Use shielded signal cables for digital I/O and shielded twisted-pair cables for analog signals.
• Perform insulation resistance and ground continuity tests after completing all wiring.

Software Configuration

• Use EcoStruxure Control Expert for hardware mapping, variable definition, and program downloading.
• Verify logic in a simulation environment before initial power-on.

Functional Testing

• Check CPU, I/O, and communication status via the built-in diagnostic page after power-on.
• Execute point-by-point I/O testing and communication connectivity verification.

Routine Maintenance

• Inspect fans and heat sinks for dust accumulation every 6 months.
• Regularly back up project files and system parameters.
• Monitor CPU temperature, memory usage, and error logs via remote diagnostic functions.

Troubleshooting

• For hardware failures, first remove and replace the corresponding sub-module via hot-swapping.
• If the system fails to start, use a USB boot disk for firmware recovery or contact an authorized Schneider service center.

If you would like to learn more about our products and services, please feel free to contact us at any time!

• Sales Manager : Jinny
• Email : sales5@xrjdcs.com
• Whatsapp/Mobile:+86 15359273791

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