XYCOM 9457-0238120011

XYCOM 9457-0238120011 is an industrial-grade embedded computer launched by XYCOM, belonging to the XVME product series. Positioned as a high-performance, highly reliable computing platform designed for harsh industrial environments, this model is widely used in automation control, data acquisition, image processing, and other fields.

Key Technical Specifications

• Processor: Supports multiple industrial-grade CPUs (Intel® or AMD® optional) with a clock speed range of 1.6 GHz–3.2 GHz and multi-core computing capability.
• Memory: Maximum support for 64 GB DDR4 ECC memory to ensure data integrity.
• Storage: Equipped with a 2.5-inch SATA hard drive bay (SSD optional) and supports NVMe M.2 expansion.
• I/O Interfaces:Display: Integrated dual VGA/HDMI display ports, supporting external industrial monitors.
  • 4 PCI-Express x1 slots, 2 PCI-Express x4 slots
  • 8 USB 3.0 ports, 4 USB 2.0 ports
  • Multiple serial ports (RS-232/RS-485) and CAN bus interfaces
  • Supports 10/100/1000 Mbps Ethernet with redundant network card option
• Power Supply: Wide input voltage range 100-240 V, typical power consumption 30 W, with power redundancy design.
• Operating Temperature: -40 °C to +85 °C, complying with industrial temperature standards.
• Dimensions: 6U (dual-slot) VME-bus form factor, compatible with standard chassis dimensions.

Product Features

• High Reliability: Adopts industrial-grade components with anti-vibration, shock-resistant, dustproof, and moisture-proof designs.
• Modular Structure: Flexible addition/removal of PCIe, I/O, storage, and other modules according to requirements, facilitating future upgrades.
• Long Lifespan Support: Provides long-term supply and technical services, suitable for long-term project deployment.
• Multi-System Compatibility: Supports Windows, Linux, Real-Time Operating Systems (RTOS), and other platforms.
• Strong Expandability: Compatible with various backplanes and peripheral modules of the XVME series, enabling the construction of complete industrial control systems.

Structure and Composition

• Motherboard: Core computing and I/O control circuit, integrating CPU socket, memory slots, and PCIe slots.
• Power Module: Wide input range, redundant design, equipped with power monitoring circuit.
• Cooling System: High-efficiency fan + heat sink to ensure stable operation in high-temperature environments.
• Backplane (VME-bus): Provides high-speed bus connection with upper computers or other industrial modules.
• Peripheral Interface Cards: Optional serial port, CAN, Ethernet, and USB expansion cards.
• Chassis: Complies with 6U dual-slot industrial chassis standards, equipped with protective covers and mounting brackets.

Typical Application Fields

• Industrial Automation: PLC, SCADA, robot control systems.
• Data Acquisition and Monitoring: Sensor networks, on-site data recording.
• Image Processing: Machine vision, quality inspection.
• Transportation: Train control, signal systems.
• Energy Management: Power station monitoring, smart grid.
• Military/Aviation: High-reliability embedded platforms.

Installation and Maintenance Guidelines

Installation

1. Fix the host in a VME-bus standard cabinet, ensuring alignment between the backplane and motherboard slots.
2. Check the polarity when connecting the power cord and use dustproof and moisture-proof terminals.
3. Insert corresponding I/O expansion cards according to on-site requirements, ensuring secure card insertion.
4. After powering on, perform a basic BIOS/UEFI check to confirm hardware detection is normal.

Maintenance

1. Regularly inspect the cleanliness of cooling fans and heat sinks to prevent overheating caused by dust accumulation.
2. Monitor the voltage and current of the power module, and replace aging capacitors or fuses in a timely manner.
3. For redundant networks or power supplies, conduct regular switching tests to verify the availability of backup paths.
4. It is recommended to use the latest firmware and drivers provided by XYCOM official to obtain security patches and performance optimizations.
5. When replacing or upgrading modules, ensure the power is disconnected to avoid electrostatic damage to components.

If you would like to learn more about our products and services, please feel free to contact us at any time!

• Sales Manager : Jinny
• Email : sales5@xrjdcs.com
• Whatsapp/Mobile:+86 15359273791

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Triconex  丨   Foxboro 丨   ICS Triplex  丨  Hima  丨  Schneider 丨  Yokogawa  丨 Woodward

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