XYCOM PM-102036

XYCOM PM-102036 is an industrial-grade modular control platform in the XYCOM series, designed for scenarios such as automated production lines, process control, machine vision, and embedded systems. Positioned as a high-reliability, long-life, and easy-to-maintain industrial computer, it complies with industrial environment standards including IEC 60945 and EN 50155, enabling direct use in on-site environments with wide temperature ranges, high humidity, and strong electromagnetic interference.

Key Technical Specifications

• Processor: Intel Atom E3845 (quad-core, 1.91 GHz) or optional i5/i7 series CPUs
• Memory: DDR3/DDR4 SO-DIMM, up to 16 GB
• Storage: 2.5-inch SATA SSD/HDD with RAID 0/1 support; optional M.2 NVMe SSD
• Display: 1 or 2 channels of VGA/HDMI/DP output, up to 1920×1080 @ 60 Hz (4K optional)

I/O Interfaces

• USB 3.0 × 4, USB 2.0 × 2
• RS-232/RS-485 × 2 (CAN, Profibus optional)
• Ethernet 10/100/1000 Mbps × 2 (PoE supported)
• PCIe x1 slot
• Power Supply: Wide input 100-240 V AC, 150 W power, with overvoltage, overcurrent, and short-circuit protection
• Operating Temperature: -20 °C ~ +60 °C (industrial protective case optional)
• Protection Class: IP 40 (IP 65 protective case optional)
• Size: 3U
• Certifications: CE, FCC, RoHS, ISO 9001

Product Features

• Modular Design: Motherboard, I/O expansion cards, and power supply modules can be replaced independently, facilitating quick upgrades and maintenance.
• High Reliability: Adopts industrial-grade components with resistance to vibration, shock, and electromagnetic interference, achieving MTBF > 200,000 hours.
• Long-Life Power Supply: Wide voltage range and operating temperature interval adapt to harsh on-site environments.
• Multi-Protocol Support: Built-in industrial communication protocols such as serial port, CAN, Profibus, and Modbus TCP for easy integration into existing SCADA systems.
• Easy Maintenance: Front-panel hot-swappable I/O interfaces; supports remote diagnosis and firmware OTA upgrade.
• Security Features: Hardware TPM, Secure Boot, and IPMI remote management meet industrial information security requirements.

Structure and Composition

• Main Chassis: Aluminum alloy housing with internal layout divided into three key sections (CPU, memory & storage, power supply module) and reserved heat dissipation channels.
• I/O Expansion Board: Optional function cards for digital signals, analog signals, and fieldbuses, featuring plug-and-play design.
• Power Supply Module: Internal 150 W switching power supply with input filtering, output voltage regulation, and overload protection.
• Heat Dissipation System: Combined active fan and passive heatsink, supporting fanless operation mode (for low-power configurations).
• Interface Panel: Front-mounted USB ports, indicator lights, and emergency stop button for convenient on-site operation.

Typical Application Areas

• Automated Production Lines: PLC replacement, machine vision processing, motion control.
• Process Control: Monitoring and regulation of continuous production processes in chemical, food and beverage, pharmaceutical industries, etc.
• Industrial Robots: Core computing platform for motion control and upper-level machines.
• Smart Transportation: Traffic light control, on-board monitoring, road monitoring terminals.
• Energy Management: Wind power and photovoltaic inverter monitoring, power distribution automation.
• Embedded HMI: Integrated touchscreen solutions providing local human-machine interaction.

Installation and Maintenance Guidelines

Installation

1. On-site Inspection: Verify that power voltage, ambient temperature, and vibration levels meet product specifications.
2. Chassis Fixing: Secure the chassis to shockproof brackets or cabinets using bolts, ensuring unobstructed heat dissipation channels.
3. Wiring: Connect power, network, serial port, and fieldbus cables to corresponding I/O interfaces according to wiring diagrams, avoiding misconnections.
4. Power-On Test: Check all connections before first power-on; observe indicator lights after power-on to confirm successful system self-test.
5. Software Deployment: Install operating systems (Windows IoT, Linux Embedded) via USB or network, and load required drivers and applications.

Daily Maintenance

1. Regular Cleaning: Clean dust from fans and heatsinks every 3-6 months to maintain heat dissipation efficiency.
2. Firmware Upgrade: Use the provided OTA tool to check and update BIOS, drivers, and security patches.
3. Fault Diagnosis: Use IPMI/WEB management interface to monitor hardware health status (temperature, voltage, fan speed); remotely restart or replace faulty modules in case of abnormalities.
4. Spare Parts Management: It is recommended to keep key components such as power supply modules, fans, and memory modules on-site for quick replacement and maximum uptime.

If you would like to learn more about our products and services, please feel free to contact us at any time!

• Sales Manager : Jinny
• Email : sales5@xrjdcs.com
• Whatsapp/Mobile:+86 15359273791

Global renowned brand cooperation

ABB 丨 GE 丨Allen Bradley  丨  Honeywell 丨   Emerson  丨  Bently Nevada   丨 Westinghouse  

Triconex  丨   Foxboro 丨   ICS Triplex  丨  Hima  丨  Schneider 丨  Yokogawa  丨 Woodward

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