Product Overview
The Lam Research 853-167909-013 is a pneumatic isolation and switching valve module engineered for the rigorous process environments of semiconductor manufacturing equipment. It serves as a critical actuating component within the fluid control subsystem of Lam Research etching and deposition tools.
Upon receiving control system commands, the module drives valve core movement via compressed air to deliver precise on-off control and flow regulation of process gases, coolants, and specialty chemicals. In plasma etching processes, the valve accurately introduces or cuts off process gas flows following predefined recipe timings. Its response speed and sealing reliability directly determine the timeliness of process switching and chamber atmosphere purity, further influencing etching rate stability and wafer-to-wafer uniformity.
Product Specifications
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Parameter Name
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Parameter Value
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Product Model
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853-167909-013
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Manufacturer
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Lam Research
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Product Type
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Pneumatic Isolation Valve / Switching Valve Module
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Valve Body Material
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316L Stainless Steel / Hastelloy (optional), electropolished surface
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Sealing Material
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FFKM (Perfluoroelastomer) or PTFE (Polytetrafluoroethylene)
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Sealing Method
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Diaphragm seal or bellows seal (zero-leakage structure)
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Actuation Method
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Double-acting pneumatic actuator (supply pressure: 80–100 PSI)
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Port Type
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1/4-inch or 3/8-inch VCR metal face seal fitting (standard configuration)
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Orifice Size
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4mm – 8mm (subject to specific configuration)
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Response Time
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< 100 ms (full stroke opening/closing)
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Internal Leakage Rate
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< 1×10⁻⁹ atm·cc/sec (helium leak test)
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External Leakage Rate
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Zero leakage (metal diaphragm seal)
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Maximum Working Pressure
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100 PSIG (gas) / 50 PSIG (liquid)
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Working Temperature Range
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10°C to 100°C (media temperature)
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Mechanical Lifespan
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> 1,000,000 cycles (maintenance-free)
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Installation Method
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Modular bracket mounting or panel mounting
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Structure and Composition
The Lam Research 853-167909-013 is designed in strict accordance with the highest UHP fluid control component standards for semiconductor applications. It features a regular block or cylindrical profile, with a monolithic body precision-machined from high-purity stainless steel or corrosion-resistant alloy via multi-axis CNC processing. The body undergoes electropolishing to achieve ultra-low surface roughness and superior corrosion resistance.
Equipped with inlet and outlet ports for process media in standard VCR metal face seal design, the valve ensures reliable metal-to-metal sealing to eliminate leakage risks. A pneumatic actuator is mounted on the top or side of the valve body and connected to external solenoid valves via pneumatic tubing.
The core internal sealing structure adopts either diaphragm or bellows configuration. For diaphragm-type valves, high-purity PTFE or FFKM diaphragms form a sealing pair with the valve seat through compression mechanisms. Downward pressure from the actuator presses the diaphragm tightly against the seat to cut off flow, while upward lifting opens the media channel. For bellows-sealed versions, metal bellows isolate the valve core from the atmospheric side for dynamic sealing, maintaining ultra-low internal and external leakage even after millions of operational cycles.
The streamlined flow channel design eliminates dead zones and abrupt transitions, minimizing particle retention and contaminant accumulation. Some units are integrated with position indicator sensors that output switch signals based on valve core position, enabling closed-loop status confirmation for the control system.
Key Features and Advantages
1. Ultra-High Purity and Minimal Particle Generation
Specially optimized for semiconductor UHP process environments, the valve’s flow channel is precision electropolished to a surface roughness of Ra < 0.25μm, drastically reducing particle adhesion and contaminant growth. The metal diaphragm and bellows sealing structures deliver true zero external leakage, while tight diaphragm-seat contact ensures ultra-low internal leakage at the 1×10⁻⁹ atm·cc/sec level verified by helium testing. This high-purity performance prevents process gas and chemical contamination, meeting the stringent particle and metal impurity requirements of advanced semiconductor processes.
2. Fast Response and High Operational Reliability
Equipped with an optimized pneumatic actuator and spring reset mechanism, the valve achieves full-stroke opening and closing within 100ms, supporting high-speed gas switching required by precision process recipes. The double-acting pneumatic drive provides stable and sufficient driving force for both opening and closing strokes, independent of media pressure. Precisely matched moving components and low-friction sealing materials sustain consistent actuation and sealing performance after over one million cycles, effectively reducing unplanned downtime caused by valve failure.
3. Superior Corrosion Resistance and Extended Service Life
Validated through rigorous corrosion testing, the valve body and internal seals adapt to harsh semiconductor process media, including corrosive gases such as Cl₂, HBr, and BCl₃, as well as chemicals like HF and SC1. The combination of stainless steel body and chemical-resistant FFKM/PTFE diaphragms ensures long-term stable operation across wide temperature and chemical environments without performance degradation. Excellent corrosion resistance extends component lifespan and prevents wafer yield loss caused by metal ion contamination from material corrosion.
Application Fields
The Lam Research 853-167909-013 is widely deployed in front-end semiconductor manufacturing processes, including plasma etching, atomic layer deposition (ALD), and wafer cleaning. It serves as a standard fluid control component for Lam Research 2300-series etchers, Versys-series cleaning tools, and multiple deposition systems, mainly installed in gas boxes, chemical delivery modules (CDM), and vacuum exhaust systems.
In logic and memory chip manufacturing, the valve controls timed etching gas injection, on-off switching of purge gases (N₂, Ar), and isolation switching of coolant circulation loops. It solves three core production challenges in high-volume semiconductor manufacturing:
- Precise Timing Control: Fast switching action enables millisecond-level sequential injection of multiple process gases into reaction chambers, ensuring accurate interface control for multi-layer thin-film etching and deposition.
- Equipment Safety Interlock: Rapidly cuts off hazardous gas supply during emergency shutdowns or abnormal conditions to protect equipment and operating personnel.
- High-Purity Process Maintenance: Zero-leakage design and ultra-low particle generation minimize negative impacts on chamber vacuum and atmosphere purity, laying a solid foundation for high-yield etching and deposition results.
Related Products
- 853-167909-014: Normally closed (NC) pneumatic valve module of the same series. Different from the 853-167909-013 in fail-safe mode, it adapts to diverse safety strategy requirements.
- 853-167909-002: Manual isolation valve in the same product line, designed for manual cut-off during equipment commissioning and maintenance without automatic pneumatic control function.
- 852-011101-001: Matching pneumatic solenoid valve that converts electrical control signals into compressed air directional switching, acting as the pilot control component for driving the 853-167909-013.
- 872-200030-025: Diaphragm seal repair kit compatible with the valve, including replacement diaphragms, gaskets, and installation tools for on-site replacement of aging sealing components.
- 853-167909-101: Same-series valve module with upgraded port sizes (e.g., 1/2-inch VCR) for high-flow gas and liquid pipeline applications.
- 852-020001-005: Special VCR fitting gaskets for sealing connections between the 853-167909-013 and process pipelines, requiring replacement after each disassembly.
- 572-200030-050: Valve position sensor kit, including inductive proximity switches and mounting brackets, providing electrical feedback confirmation of valve open/closed status.
Installation and Maintenance
Pre-Installation Preparation
Before installing the 853-167909-013, fully depressurize all connected gas and chemical pipelines and complete sufficient purging with inert gas to eliminate residual hazardous media. Operators must wear full personal protective equipment (PPE), including chemical-resistant gloves, face shields, and chemical suits, and perform installation in well-ventilated environments.
Verify valve port specifications and sealing surface conditions to ensure scratch-free and deformation-free VCR end faces and gaskets. Tighten VCR nuts with professional torque wrenches following the standard “hand-tight plus 1/4 turn” rule, and confirm proper compression with a feeler gauge. For pneumatic tubing connection, ensure the air supply pressure stays within the rated 80–100 PSI range and verify correct pipeline routing.
Maintenance Guidelines
During equipment operation, regularly monitor valve status feedback via the tool control system. Investigate abnormal actuation delay or inconsistent position feedback signals by checking pneumatic supply pressure and solenoid valve operating status promptly.
Perform annual preventive maintenance including helium leak detection on valve body seals and pipe connections. Replace diaphragm seal kits before reaching the rated cycle lifespan for frequently actuated valves. Internal leakage usually requires diaphragm or valve seat replacement, while external leakage indicates loose VCR fittings or failed gaskets.
Before reactivating long-idle valves, conduct multiple no-load cycle tests to verify actuation flexibility and sealing integrity. All maintenance operations must strictly comply with official Lam Research maintenance manuals and safety specifications.