Xycom 70091-001

The Xycom 70091‑001 is a VME‑bus I/O module in the Xycom Automation series. It is specifically designed for industrial automation environments that demand high reliability and strict real-time performance. The module adopts a standard 6U (or 9U) VME backplane, allowing direct insertion into a VME chassis for modularity, hot-swappability, and quick maintenance.

Key Technical Specifications

• Bus Standard: VME‑bus (32‑bit, up to 160 MB/s, compatible with VME64x)
• Power Supply: VME backplane +5 V/‑12 V; Operating temperature range: –20 °C ~ +70 °C
• I/O Ports: Provides multiple channels for analog/digital signal acquisition and output (the exact number of channels varies by sub-model)
• Communication Interface: P2 connector for signals and power, supporting RS‑232/RS‑485 serial port expansion
• Mechanical Dimensions: Compliant with standard 6U (160 mm width) or 9U (233 mm width) Eurocard specifications
• Protection Level: Industrial-grade dustproof and moisture-proof design, meeting NEMA 4 standards

Product Features

• Modular Design: Utilizes a rear-pluggable backplane and supports hot swapping, facilitating on-site quick replacement and maintenance.
• High Reliability: Features a metallized backplane, vibration resistance, and shock resistance, complying with industrial EMC requirements.
• Multi-Protocol Compatibility: Enables bridging to fieldbuses such as MODBUS, PROFIBUS, and Ethernet via software.
• Wide Temperature Operation: Functions within the range of -20 °C ~ +70 °C, suitable for harsh environments like petrochemical, metallurgy, and power industries.
• Rich I/O Options: Includes analog input (0‑10 V/4‑20 mA), digital input/output, counters, and pulse outputs, allowing flexible configuration.

Structure and Composition

• Backplane: Provides VME bus signals, power supply, and heat dissipation channels.
• Module: Consists of power filtering circuits, signal conditioning circuits, I/O interface chips (e.g., AD, DA, counters), and a microcontroller/FPGA for local data processing.
• Connectors: Standard VME interfaces including P0/P1 (for power and address) and P2 (for I/O); some models are equipped with dedicated high-speed serial interfaces.
• Heat Dissipation Device: Features large vents or heat sinks to ensure thermal management during long-term operation.

Typical Application Fields

• Petrochemical Industry: Process control, flow/temperature/pressure monitoring.
• Power Systems: Real-time data acquisition and protection control in power plants and substations.
• Metallurgy and Steel Industry: Sensor signal processing in high-temperature and high-noise environments.
• Pharmaceutical and Food Industry: Process monitoring that meets GMP requirements.
• Automated Production Lines: I/O expansion for robots and CNC machine tools.
• Testing and Measurement: High-precision data acquisition in aerospace and rail transit fields.

Installation and Maintenance Points

1. Pre-Installation Check: Verify that the chassis power supply and grounding comply with VME standards; check that the module’s gold fingers are clean and free of oxidation.
2. Hot-Swapping Operation: Perform hot swapping only after the system enters safe mode or is powered off; if hot swapping is supported, ensure the interrupt of the corresponding slot is disabled at the software level first.
3. Fixing and Heat Dissipation: Secure the module firmly to the backplane using screws to ensure unobstructed heat dissipation channels; install additional fans or heat-conducting pads if necessary.
4. Cabling and Wiring: Use shielded cables to connect on-site sensors to avoid electromagnetic interference; check signal integrity after wiring.
5. Regular Maintenance: Clean the gold fingers and inspect the fixation of heat sinks every 6 ~ 12 months; update firmware to obtain the latest compatibility and security patches.

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If you would like to learn more about our products and services, please feel free to contact us at any time!

• Sales Manager : Jinny
• Email : sales5@xrjdcs.com
• Whatsapp/Mobile:+86 15359273791

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