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XYCOM PCS83594A Memory Board
XYCOM PCS83594A
PCS83594A is an industrial-grade Memory Board launched by XYCOM, designed to deliver high-speed and reliable storage expansion for XVME, VME, and other modular bus systems. Positioned for automation control, industrial computing, and embedded system scenarios that demand large capacity, low power consumption, and high reliability, this product excels in meeting the stringent requirements of industrial applications.
Key Specifications
- Interface Type: XVME, RS-485, Ethernet (10/100 Mbps)
- Storage Capacity: Optional 8 GB, 16 GB, 32 GB, with maximum support for 64 GB DDR4/HBM (customizable)
- Operating Voltage: 24 V DC (supports 18-30 V range)
- Operating Temperature: -20 °C to 60 °C, suitable for harsh industrial environments
- Protection Class: IP65 (dustproof and waterproof)
- Dimensions: Approximately 150 mm × 100 mm × 50 mm (width × depth × height)
- Power Consumption: Features low-power chip design with passive heat dissipation, ensuring operating power is below 10 W
Product Features
- Modular Plug-and-Play Design: Supports hot-swapping to simplify installation and maintenance, minimizing system downtime.
- High Reliability: Adopts industrial-grade components and IP65 protection, enabling long-term stable operation in high-temperature, humid, or dusty environments.
- Low Power Consumption & Efficient Heat Dissipation: The passive heat dissipation structure combined with low-power chips reduces energy consumption and extends service life.
- Flexible Expansion: Storage capacity can be customized according to requirements, and it is compatible with multiple processor platforms (such as Intel Xeon series).
- Multi-Interface Compatibility: Provides RS-485, Ethernet, and XVME interfaces simultaneously, facilitating seamless integration with existing industrial bus systems.
Structure and Components
- Storage Module: Equipped with DDR4/HBM memory chipset for high-speed read and write operations.
- Control Chip: Responsible for bus protocol conversion, error checking and correction (ECC), and hot-swapping management.
- Heat Sink: Full-aluminum passive heat sink ensures low temperature under high-load conditions.
- Interface Board: Integrates XVME, RS-485, and Ethernet ports, enclosed in a protective casing.
- Power Management Unit: Offers voltage stabilization and overcurrent protection, compatible with 24 V DC power supply.
Typical Application Fields
- Industrial automation control systems
- Embedded computing platforms for rail transit and aerospace
- Edge computing nodes for robotics and intelligent manufacturing
- Process control and monitoring systems (e.g., petroleum, chemical industry)
- Power and energy management systems with high reliability requirements
Installation and Maintenance Guidelines
Installation
Insert the memory board into the corresponding XVME slot in the chassis and ensure the latch is locked. When using the hot-swapping function, disconnect the power supply before replacement.
Wiring
Connect RS-485 or Ethernet ports as needed, ensuring signal lines are well-shielded to avoid electromagnetic interference.
Heat Dissipation Inspection
Verify that the heat sink and chassis vents are unobstructed; additional fans can be installed if necessary to improve heat dissipation efficiency.
Power Monitoring
Use power management software to monitor voltage and power consumption, and detect abnormalities in a timely manner.
Firmware Upgrade
Regularly check for firmware updates released by XYCOM official; upgrading firmware can enhance compatibility and performance.
Troubleshooting
When errors occur, first inspect bus connections, power supply status, and heat dissipation conditions. If the issue persists, replace the storage module for troubleshooting.
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